$VIAV KEY READ-THROUGHS FROM VIAVI SOLUTIONS Q3 FY26 EARNINGS CALL
VIAVI’s Q3 FY26 call was a high-signal upstream datapoint for AI infrastructure, high-speed optical/electrical interconnect, co-packaged optics, semiconductor test intensity, memory scarcity, cable access, and defense autonomy. The most important broader-market implication is that AI data center demand is no longer confined to accelerator procurement or early lab validation; it is now propagating into production test, field fiber monitoring, optical module manufacturing, semiconductor packaging, high-speed Ethernet validation, and deployment assurance. The call also provided a clear negative read-through for wireless RAN and 5G test recovery, with management explicitly stating that wireless demand remains weak and no near-term recovery is expected. The highest-conviction positive cross-sector signals are for AI networking silicon, optical modules, high-speed test and measurement, advanced packaging/test, memory suppliers, cable DAA vendors, and defense PNT/autonomy suppliers. The highest-conviction negative or mixed signals are for wireless RAN equipment, wireless test-exposed names, hyperscaler free cash flow intensity, and smaller optical/module manufacturers facing rising test complexity and yield risk.
AI DATA CENTER TEST DEMAND HAS MOVED FROM LAB VALIDATION INTO PRODUCTION AND FIELD DEPLOYMENT (READ-THROUGH 1)
Call evidence: VIAVI reported NSE revenue of $321.5M, above the $304M-$316M guide, up 54.4% year-over-year. Management attributed the growth to “strong demand for our lab and production and field products driven by the data center ecosystem.” Oleg Khaykin stated that “we are seeing strong demand across all data center segments, scale up, scale out, and scale across,” and added that “given strong and growing customer demand, we expect the data center ecosystem revenue momentum to continue through the calendar 2026.” The most differentiated comment was on field instruments: “I’ve never seen so much demand for our fiber monitoring solutions,” and data centers are “buying more equipment than regular service providers.” Management estimated that data center demand is approaching “40%, 45%, pretty soon, probably maybe 50%” of field instruments.
Affected companies and impact:
Keysight Technologies (KEYS: US): Positive, high magnitude. The transmission mechanism is higher demand for optical transport, protocol, Ethernet, PCIe, and high-speed network validation equipment across AI labs, production environments, and deployment monitoring. VIAVI’s commentary confirms that test demand is broadening structurally, which should support the broader high-speed test category even if VIAVI gains share in specific accounts.
Anritsu (6754: Japan): Positive, medium magnitude. Anritsu should benefit from the same high-speed optical and network test cycle, but the positive data center read-through is partially offset by VIAVI’s explicit weakness in wireless test, where Anritsu has meaningful exposure.
Corning (GLW: US): Positive, medium magnitude. The mechanism is stronger AI data center fiber deployment and monitoring intensity. VIAVI’s comment that hyperscale data centers are buying fiber monitoring equipment at levels comparable to or above service providers implies elevated demand for high-density fiber infrastructure, quality assurance, and optical network reliability.
Prysmian (PRY: Italy), Sumitomo Electric Industries (5802: Japan), and Furukawa Electric (5801: Japan): Positive, medium magnitude. The mechanism is increased fiber intensity in AI data center campuses and interconnect architectures, with more monitoring, more deployment verification, and more fiber-related test insertion as bandwidth scales.
Near-term trading catalyst: The Q4 guide implies continued sequential growth in NSE, and management explicitly guided data center momentum through calendar 2026.
Longer-duration fundamental shift: Field instrumentation is being structurally repositioned away from a service-provider-only demand pool toward a hyperscaler and AI data center operating model. This is non-consensus relative to the historical view of field test as a telecom capex proxy.
HIGH-SPEED ETHERNET, 800G VOLUME, 1.6T RAMP, AND 3.2T DESIGN ACTIVITY SUPPORT AI NETWORKING SILICON AND SWITCHING WINNERS (READ-THROUGH 2)
Call evidence: Management stated that 800G remains “very much a high volume driver,” while 1.6T is “ramping in a lab” and entering “early production products to the module vendors.” VIAVI released 1.6T products approximately 1.5 years ago, and adoption has expanded from network equipment manufacturers to semiconductor vendors and co-packaged optics customers. On Spirent, management said the “first truly integrated product” between VIAVI and Spirent will be at “3.2 terabits.” VIAVI also said customers developing “AI chips for inference or the training” are buying optical transport and protocol test solutions.
Affected companies and impact:
Broadcom (AVGO: US): Positive, high magnitude. The mechanism is direct validation of sustained demand for AI networking silicon, switching ASICs, custom silicon, high-speed SerDes, and optical connectivity roadmaps. A test vendor seeing 800G volume, 1.6T lab ramp, and 3.2T development is an upstream confirmation that networking semiconductor cycles remain active.
Marvell Technology (MRVL: US): Positive, high magnitude. The mechanism is accelerating demand for custom silicon, optical DSPs, high-speed connectivity, and data center interconnect components tied to AI fabrics. VIAVI’s commentary around chip-to-chip interconnect and co-packaged optics supports a higher-growth connectivity content cycle.
Credo Technology Group (CRDO: US): Positive, medium-high magnitude. The mechanism is rising demand for high-speed connectivity, active electrical cables, SerDes-heavy AI fabric infrastructure, and Ethernet scaling. The call reinforces that AI networks are speed- and signal-integrity-constrained, which is favorable for high-speed connectivity specialists.
Astera Labs (ALAB: US): Positive, medium magnitude. The mechanism is broader PCIe and high-speed connectivity complexity around AI systems. VIAVI specifically cited “PCIe Express test products” in the context of AI chip and system development, supporting the view that connectivity validation remains a critical bottleneck.
Arista Networks (ANET: US): Positive, high magnitude. The mechanism is sustained AI Ethernet fabric expansion. VIAVI’s references to high-speed Ethernet, optical switches, NEM demand, and 800G/1.6T ramps are positive indicators for AI cluster switching demand and next-generation data center switching roadmaps.
Cisco Systems (CSCO: US) and Hewlett Packard Enterprise (HPE: US): Positive, medium magnitude. The mechanism is incremental support for AI data center switching and high-speed networking opportunities, though each company’s broader enterprise and service-provider mix dilutes the magnitude relative to Arista.
Near-term trading catalyst: 800G remains in volume, and 1.6T is already ramping in lab and early production.
Longer-duration fundamental shift: The test cycle points to a multi-year AI networking roadmap extending from 800G to 1.6T and 3.2T, with increasingly complex electrical, optical, and protocol validation requirements.
OPTICAL MODULE AND SILICON PHOTONICS DEMAND IS STRONG, BUT TEST INTENSITY CREATES A WINNER-TAKE-MORE MANUFACTURING DYNAMIC (READ-THROUGH 3)
Call evidence: VIAVI said the data center ecosystem includes “high-performance semis, optical modules, NEMs, and hyperscalers.” Management described “strong demand” for optical transport, silicon photonics, communication protocol, and high-speed Ethernet test equipment. On production, Khaykin said VIAVI is seeing “a lot of momentum on this whole co-packaged optic area” and is selling equipment to semiconductor vendors developing “integrated packaged optic solution.” In Q&A, management added that every component in a complex optical module must be tested before final integration because “if you have one device is bad, you throw away the entire” sealed module.
Affected companies and impact:
Coherent (COHR: US): Positive, high magnitude, with medium execution risk. The mechanism is stronger demand for optical modules, silicon photonics, and high-speed optical components tied to AI data center scale-out. The risk is that rising test intensity and yield sensitivity increase manufacturing complexity and working-capital demands.
Lumentum (LITE: US): Positive, medium-high magnitude. The mechanism is stronger AI optical demand and silicon photonics-related validation requirements. Magnitude is somewhat lower than Coherent and Fabrinet because the read-through depends on mix exposure to the highest-growth AI optical products.
Fabrinet (FN: US): Positive, high magnitude. The mechanism is outsourcing demand for complex optical manufacturing, testing, and production execution. VIAVI’s commentary that optical components must be tested at multiple insertion points favors scaled contract manufacturers with strong process control and test infrastructure.
Zhongji Innolight (300308: China): Positive, high magnitude. The mechanism is continued 800G volume and emerging 1.6T demand from hyperscalers and module customers. The call’s optical module commentary reinforces demand durability, although export controls and customer concentration remain separate risks not directly addressed in the call.
Eoptolink Technology (300502: China): Positive, medium-high magnitude. The mechanism is similar to Zhongji Innolight, with AI data center optical module demand and higher-speed transition support. The magnitude is high for demand but moderated by competitive and geopolitical risk.
Negative/mixed implication: Smaller or less automated optical module manufacturers face negative medium impact from the same trend. The mechanism is higher test capex, more insertion points, tighter yield requirements, and greater risk that defective components destroy value late in the production flow. CPO and silicon photonics reward scale, process control, and capital availability.
Near-term trading catalyst: 800G remains a high-volume driver, while 1.6T is entering early production products for module vendors.
Longer-duration fundamental shift: Optical module competition increasingly shifts from simple capacity and pricing toward yield management, test infrastructure, photonic integration, and manufacturing execution.
CO-PACKAGED OPTICS AND ADVANCED PACKAGING ARE TURNING TEST AND PACKAGING INTO STRATEGIC BOTTLENECKS (READ-THROUGH 4)
Call evidence: When asked whether testing is becoming a bottleneck in co-packaged optics, Khaykin responded, “You’re absolutely right.” He stated that “the whole test packaging used to be kind of a backhand afterthought. It is now the system. It’s now strategic assets.” He described glass substrates, photonic integrated circuits next to electronic integrated circuits, wafer-level packaging, heterogeneous integration packaging, and custom rack-mounted test systems. He also said VIAVI’s technologies are being pulled into the value chain from “individual optical components to wafer level packaging, to the heterogeneous integration packaging, all the way down to being integrated into major test platforms.”
Affected companies and impact:
Advantest (6857: Japan): Positive, medium-high magnitude. The mechanism is rising semiconductor test complexity as AI devices incorporate faster electrical interfaces, optical-adjacent integration, and more advanced packaging. Although VIAVI’s specific exposure is optical and communications test, the broader implication is more test value per AI package.
Teradyne (TER: US): Positive, medium magnitude. The mechanism is greater electrical test complexity and higher-value package-level validation in AI and high-speed semiconductor devices. The read-through is positive, though less direct than for optical/network test vendors.
FormFactor (FORM: US): Positive, medium magnitude. The mechanism is increased wafer-level and package-level probing requirements as photonic and electronic components converge in heterogeneous integration flows.
Onto Innovation (ONTO: US) and Camtek (CAMT: Israel): Positive, medium magnitude. The mechanism is more inspection, metrology, and process-control demand in advanced packaging and heterogeneous integration environments.
Amkor Technology (AMKR: US), ASE Technology (3711: Taiwan), and BE Semiconductor Industries (BESI: Netherlands): Positive, medium magnitude. The mechanism is higher advanced packaging intensity as CPO, photonic integration, glass substrates, and heterogeneous architectures move closer to production. Packaging capability becomes a strategic differentiator rather than a back-end commodity process.
Near-term trading catalyst: Management said CPO/OCS-related sales are early and “not in the current numbers,” but could start ramping in “2 to 3 quarters.”
Longer-duration fundamental shift: The call strongly supports the thesis that AI hardware value creation is shifting toward advanced packaging, photonic integration, and test/inspection intensity, not only front-end wafer fabrication.
VIAVI-SPIRENT COMBINATION RAISES COMPETITIVE RISK IN HIGH-SPEED ETHERNET TEST DESPITE POSITIVE CATEGORY DEMAND (READ-THROUGH 5)
Call evidence: Spirent revenue was $54.2M in Q3, in line with expectations and helped by orders pushed out from the prior quarter. Management expects roughly a $200M annual run-rate, with Q4 likely “just shy of the $50M, maybe $48M.” Strategically, Khaykin stated that Spirent brings “a pretty big established customer base” and “application-hardened software for all kinds of Ethernet traffic,” while VIAVI is “upgrading the hardware performance of their products.” He added that the 3.2T product will be the first truly integrated VIAVI-Spirent platform.
Affected companies and impact:
Keysight Technologies (KEYS: US): Mixed, medium magnitude. The category demand read-through is positive, but the competitive read-through is negative. The mechanism is that VIAVI now combines high-performance optical/network hardware with Spirent’s Ethernet traffic software and installed base, potentially increasing share pressure in high-speed Ethernet and protocol test.
Anritsu (6754: Japan): Mixed to negative, medium magnitude. The mechanism is the same competitive pressure in high-speed network test, compounded by VIAVI’s separate comment that wireless test demand remains weak.
VIAVI customers in semis, NEMs, and hyperscalers: Positive, medium magnitude. The mechanism is a potentially stronger integrated supplier offering optical transport, protocol, and Ethernet traffic validation at 3.2T, improving procurement efficiency and roadmap alignment.
Near-term trading catalyst: Q3 Spirent contribution was strong, but Q4 normalization means near-term revenue support moderates.
Longer-duration fundamental shift: The acquisition can evolve from revenue addition to product-cycle leverage if the 3.2T integrated platform is competitive. This raises share-risk questions for incumbent high-speed Ethernet test vendors.
