$INTC $TSM $GFS $AMKR SCOPE AND SCREEN
The publicly identifiable US universe of companies with semiconductor wafer-fabrication, foundry, specialty microfabrication, or advanced-packaging facilities is substantially broader than the leading-edge logic names typically associated with CHIPS Act reshoring. The relevant set includes pure-play foundries, IDMs with captive fabs, specialty analog and power manufacturers, compound-semiconductor and RF operators, silicon photonics and InP/GaAs/GaN producers, MEMS foundries, defense-trusted microelectronics foundries, OSATs, wafer-level packaging providers, and advanced-substrate companies. The definition used here includes operational facilities, under-construction facilities, and publicly announced facilities with sufficiently specific disclosed US locations. It excludes design-only fabless companies, administrative-only locations, universities and national labs unless a corporate or nonprofit operating entity is clearly identified, conventional EMS assembly without semiconductor-grade packaging, and historical facilities that appear closed, sold, or no longer controlled by the named company. SIA’s own ecosystem map is explicitly not exhaustive, so the list below should be treated as the best publicly disclosed corporate universe as of May 14, 2026, rather than a guarantee of classified, proprietary, or otherwise undisclosed microelectronics capacity. The SIA investment tracker indicates that post-CHIPS Act US semiconductor commitments have exceeded $645.3B across more than 140 projects in 30 states, with federal awards announced for 35 companies and 52 projects, underscoring the breadth of the reshoring footprint but also the uneven maturity of announced versus operational capacity. (Semiconductor Industry Association)
US SEMICONDUCTOR FABRICATION AND ADVANCED PACKAGING COMPANY UNIVERSE
Intel Corporation — INTC — Intel has the broadest domestic front-end and back-end manufacturing footprint among US-headquartered logic manufacturers. Key US assets include leading-edge logic capacity in Chandler, Arizona, where Fab 52 and Fab 62 are central to Intel’s advanced-node expansion; planned leading-edge fabs in New Albany, Ohio, with timing that has shifted toward 2030-2031; major R&D and process-development operations in Hillsboro, Oregon, including high-NA EUV-related work; and Rio Rancho, New Mexico, which has been positioned as a major domestic advanced-packaging hub. Intel’s New Mexico site is particularly strategic because it supports high-volume advanced packaging, including EMIB and Foveros-related capabilities, making Intel one of the few US operators with both leading-edge wafer fabrication and advanced 2.5D/3D packaging infrastructure at domestic scale. (Semiconductor Industry Association)
Taiwan Semiconductor Manufacturing Company — TSM / https://t.co/ix3wtoPzdY — TSMC’s US footprint includes Phoenix, Arizona, where the company is building a multi-fab advanced logic campus. Public disclosures describe the first Arizona fab as 4nm, the second as 3nm/2nm-class with nanosheet technology, and later capacity as 2nm or more advanced. TSMC has also disclosed a broader Arizona investment plan that includes 6 wafer fabs, 2 advanced packaging facilities, and an R&D center, implying that the US site is evolving from a single front-end fab project into a broader domestic manufacturing cluster. Separately, TSMC controls the Camas, Washington, fab through TSMC Washington, historically a mature-node 200mm facility. Arizona’s strategic significance is unusually high because it introduces external foundry capacity for leading-edge logic on US soil, although volume ramp, cost structure, customer allocation, labor productivity, and tool-install timelines remain core execution variables. (Semiconductor Industry Association)
Samsung Electronics — 005930.KS / SSNLF — Samsung’s US semiconductor manufacturing footprint includes Austin, Texas, and Taylor, Texas. The Taylor campus has been described as including 2 new leading-edge logic fabs for 4nm and 2nm-class production, an R&D fab, and advanced packaging capacity relevant to 3D HBM and 2.5D integration. The Austin facility is also being expanded or modernized for differentiated process technologies, including FD-SOI applications for aerospace, defense, automotive, and other specialty markets. Samsung’s US role is strategically important because it provides a second non-US-headquartered leading-edge foundry option in the US, but the domestic footprint remains dependent on the cadence of Taylor tool installation, customer commitments, and the company’s competitive position against TSMC at advanced nodes. (Semiconductor Industry Association)
GlobalFoundries — GFS — GlobalFoundries operates major US foundry assets in Malta, New York, and Essex Junction/Burlington, Vermont. Malta is the company’s flagship 300mm US fab and is being expanded with additional capacity and a planned new fab to support RF, automotive, aerospace, defense, and mixed-signal demand. The Vermont site is a 200mm facility being revitalized for high-volume GaN-on-silicon and other specialty technologies. GFS is not a leading-edge logic competitor at 3nm/2nm, but it is highly relevant for differentiated mature and specialty nodes where supply assurance, RF content, power management, silicon photonics, and defense-trusted manufacturing are often more important than transistor-density leadership. (Semiconductor Industry Association)
Texas Instruments — TXN — Texas Instruments has one of the most strategically significant domestic analog and embedded-processing manufacturing footprints. US assets include Richardson, Texas, where RFAB1 and RFAB2 are 300mm analog fabs; Sherman, Texas, where TI is building a large 300mm manufacturing campus with up to 4 connected fabs; Lehi, Utah, where LFAB1 and LFAB2 form a major 300mm analog and embedded-processing capacity base; and Dallas, Texas, where DMOS6 is part of the legacy analog manufacturing network. TI’s domestic 300mm analog strategy creates structural cost advantages versus 200mm analog peers and provides unusually high US-based wafer capacity for industrial, automotive, power-management, and embedded applications. (Texas Instruments)
Micron Technology — MU — Micron’s US footprint includes Boise, Idaho, Manassas, Virginia, and the planned Clay, New York, megafab complex. Boise is intended to combine high-volume DRAM production with R&D, including a large cleanroom footprint. Manassas is a legacy DRAM and specialty memory fab being modernized for 1-alpha node output and continued automotive, industrial, and defense-related memory supply. Clay, New York, is planned as a multi-fab leading-edge DRAM campus. The investment case relevance is that Micron represents the core US-based DRAM reshoring vehicle, but the timeline for New York capacity, memory-cycle cyclicality, and HBM/AI memory capital allocation remain critical gating variables. (Semiconductor Industry Association)
onsemi — ON — onsemi operates US wafer manufacturing assets in Gresham, Oregon; Mountain Top, Pennsylvania; East Fishkill, New York; and Hudson, New Hampshire. Gresham is a 200mm wafer fab supporting CMOS, BCD, EEPROM, and power technologies. Mountain Top is a 200mm wafer fab focused on MOSFET and related power processes. East Fishkill is strategically important as a 300mm fab for power discrete and image-sensor-related production and has been described as a DoD-trusted manufacturing site. Hudson is relevant to onsemi’s SiC supply chain. onsemi’s US asset base is materially weighted toward power semiconductors, analog, image sensors, and automotive/industrial end markets rather than leading-edge logic. (onsemi)
Analog Devices — ADI — Analog Devices has US manufacturing facilities in Beaverton, Oregon; Camas, Washington; and Chelmsford, Massachusetts. The Oregon and Washington sites support analog wafer fabrication around 180nm/350nm-class process technologies, while Chelmsford includes RF, microwave, packaging, and test operations. ADI’s US footprint is strategically relevant because the company’s analog, mixed-signal, RF, and high-performance signal-chain products often have long life cycles, high qualification barriers, and defense/industrial importance, making domestic continuity more significant than cutting-edge node migration. (Semiconductor Industry Association)
NXP Semiconductors — NXPI — NXP operates 4 US wafer fabs: 2 in Austin, Texas, and 2 in Chandler, Arizona. These facilities support MCUs, MPUs, power management, RF transceivers, RF amplifiers, sensors, and automotive/industrial products. Chandler has also included GaN-related RF manufacturing for 5G, aerospace, defense, and radar, although NXP disclosed plans in late 2025 to cease its radio-power product line and close the RF GaN fab by 2027. NXP therefore remains a major US mature-node and mixed-signal manufacturer, but its GaN footprint should be treated as a declining or transitional asset rather than a durable growth platform. (NXP)
Microchip Technology — MCHP — Microchip’s active US fabrication assets include Gresham, Oregon, and Colorado Springs, Colorado. These facilities support microcontrollers, analog, mixed-signal, power-management, and specialty semiconductor products, with CHIPS-related support tied to increasing output at mature-node facilities. Microchip closed the Tempe, Arizona, fab in 2024, so the relevant US footprint should be framed around Oregon and Colorado rather than legacy Arizona wafer capacity. The strategic value is mature-node supply assurance for embedded control, aerospace, defense, automotive, and industrial applications. (Semiconductor Industry Association)
SkyWater Technology — SKYT — SkyWater operates a trusted foundry in Bloomington, Minnesota, focused on 90nm/130nm-class mixed-signal, rad-hard, superconducting, carbon-nanotube, photonics, and defense-related process development and production. SkyWater also acquired Infineon’s Austin, Texas, 200mm Fab 25 in 2025, adding 130nm to 65nm capacity, high-voltage BCD infrastructure, and additional foundry scale. In advanced packaging, SkyWater Florida in Osceola County is positioned around fan-out wafer-level packaging, Deca M-Series technology, and heterogeneous integration. SkyWater is therefore one of the few small-cap public pure-play US foundry exposures, but it remains more specialty/defense/mature-node oriented than leading-edge logic oriented. (Semiconductor Industry Association)
Diodes Incorporated — DIOD — Diodes owns the South Portland, Maine, 8-inch wafer fab acquired from onsemi in 2022. The facility includes a large cleanroom footprint and supports analog, power, CMOS, BCDMOS, BiCMOS, and bipolar process technologies across roughly 0.18µm to 1.5µm nodes. The asset fits Diodes’ model as a discrete, analog, and mixed-signal manufacturer with US mature-node capacity serving automotive, industrial, and broad-based electronics demand. (Diodes Incorporated)
LA Semiconductor — Private/no direct ticker — LA Semiconductor owns the Pocatello, Idaho, 200mm fab acquired from onsemi. The site includes a 57,000-square-foot cleanroom and process technologies from roughly 0.18µm to 1.5µm, with custom process, prototype, assembly, probe, and test capabilities. The facility has faced financial and operating stress, including 2026 layoff disclosures and outside support efforts, so the asset should be viewed as strategically relevant but commercially uncertain. (https://t.co/A6xj9meoT8)
Tower Semiconductor — TSEM — Tower has US specialty foundry operations in Newport Beach, California, and San Antonio, Texas. Newport Beach supports silicon photonics, analog/mixed-signal, and specialty process technologies spanning approximately 0.50µm to 0.13µm. The US sites are part of Tower’s broader specialty-foundry portfolio, which is focused on analog, RF, power management, imaging, and silicon photonics rather than leading-edge digital logic. (SEC)
Alpha and Omega Semiconductor — AOSL — Alpha and Omega Semiconductor controls Jireh Semiconductor, its wholly owned in-house wafer fab in Hillsboro, Oregon. The facility supports AOS’s power semiconductor manufacturing model, particularly MOSFET and power-management products. The US fab is relevant because AOS is not solely outsourced to Asian foundries and maintains domestic wafer capability for part of its power-device portfolio. (Alpha & Omega Semiconductor)
X-FAB Silicon Foundries — https://t.co/4IKaXKAWop — X-FAB operates a Lubbock, Texas, SiC and specialty semiconductor foundry. The facility is described as the only high-volume SiC foundry in the US and supports power semiconductor applications, including automotive and industrial customers. X-FAB also has wafer-level packaging and 3D-integration capabilities within its broader process portfolio. The company is a meaningful US specialty foundry exposure, particularly for SiC, analog, MEMS, and mixed-signal applications. (Semiconductor Industry Association)
Polar Semiconductor — Private/no direct ticker — Polar operates a Bloomington, Minnesota, fab focused on sensor and power semiconductor manufacturing. The facility is being expanded with CHIPS support to double US production and transform Polar into a majority US-owned commercial foundry. UMC has also disclosed a memorandum of understanding with Polar to explore 8-inch chip production in the US using Polar’s expanded Minnesota fab. Polar is strategically relevant as a mature-node power and sensor foundry asset but remains less liquid and less transparent than public foundry peers. (Semiconductor Industry Association)
Everspin Technologies — MRAM — Everspin operates an integrated magnetic fab line in Chandler, Arizona, co-located with NXP. The facility supports MRAM and TMR sensor wafer manufacturing across nodes including 180nm and 130nm, with additional technology partnerships used for higher-volume MRAM nodes. Everspin’s US fab is highly specialized rather than broad-based, but it is one of the clearest domestic nonvolatile memory manufacturing assets outside conventional DRAM and NAND. (https://t.co/Z8RxTUZ9Nk)
HP Inc. — HPQ — HP’s Corvallis, Oregon, site includes specialty mature-node lab-to-fab and commercial manufacturing capabilities tied to microfluidics, printhead, and related semiconductor-derived devices. This is not a merchant foundry comparable to GFS, Tower, or SkyWater; however, it represents domestic semiconductor microfabrication and commercial device manufacturing capacity with process know-how in thin films, MEMS-like structures, and high-volume precision fabrication. (Semiconductor Industry Association)
Renesas Electronics — 6723.T / RNECY — Renesas has a Palm Bay, Florida, wafer fabrication, assembly, and test operation focused on analog, mixed-signal, high-reliability, and radiation-hardened semiconductor products. The facility is associated with MIL-PRF-38535-qualified manufacturing and wafer fabrication for high-reliability applications. Renesas also owns Transphorm in Goleta, California, following its 2024 acquisition, adding US GaN power semiconductor R&D and related capability, although the Palm Bay facility is the clearer disclosed US wafer-fab asset. (Renesas Electronics)
Wolfspeed — WOLF — Wolfspeed’s US footprint includes Siler City, North Carolina, and Marcy, New York. Siler City is focused on SiC wafer manufacturing and has been described as the largest US SiC wafer manufacturing site and a high-volume 200mm SiC wafer facility. Marcy is an automated 200mm SiC power device fab. Wolfspeed exited Chapter 11 in 2025 with a reorganized equity structure, so the operating assets remain strategically important, but the capital structure reset materially changed legacy equity economics. (Semiconductor Industry Association)
Robert Bosch GmbH — Private/no direct ticker — Bosch owns the Roseville, California, 200mm SiC fab acquired through the TSI Semiconductors transaction. The site is being converted for SiC front-end and back-end processing, with first chips expected in 2026. Bosch’s US SiC facility is strategically relevant for automotive electrification, industrial power electronics, and domestic SiC device supply, but Bosch remains privately held and not directly investable through public equity. (Semiconductor Industry Association)
Coherent Corp. — COHR — Coherent has US compound-semiconductor assets in Sherman, Texas, and Easton, Pennsylvania. Sherman supports 150mm InP optoelectronics manufacturing, including a large facility positioned around InP wafer production for optical communications and related applications. Easton supports SiC substrates, epitaxy, back-end processing, and testing. Coherent’s US footprint is strategically tied to optical interconnects, datacenter infrastructure, power electronics, and compound-semiconductor materials. (Semiconductor Industry Association)
MACOM Technology Solutions — MTSI — MACOM operates US compound-semiconductor manufacturing in Lowell, Massachusetts, and Morrisville, North Carolina. These facilities support GaN and GaAs process technologies, including 100mm and 150mm capability, and are relevant to RF, microwave, millimeter-wave, defense, aerospace, and high-frequency communications applications. MACOM is one of the more direct public-market exposures to US-based RF compound-semiconductor manufacturing. (Semiconductor Industry Association)
Qorvo — QRVO — Qorvo operates US wafer fabs in North Carolina, Oregon, and Texas, and has assembly/test operations in Texas. Its Richardson, Texas, site is a DoD Category 1A Trusted Source foundry spanning design, wafer fabrication, post-processing, packaging, assembly, and testing, with GaN and GaAs foundry processes. Qorvo’s domestic footprint is particularly important for RF front-end, defense radar, communications, and high-performance RF applications, although a substantial portion of broader Qorvo manufacturing and packaging also remains global. (Qorvo, Inc.)
Skyworks Solutions — SWKS — Skyworks has US semiconductor wafer fabrication in Newbury Park, California, and Woburn, Massachusetts. These sites are associated with RF, analog, and mixed-signal production, while the company’s broader SAW/TC-SAW/BAW and assembly/test footprint includes international manufacturing. The US fabs are relevant to RF front-end modules, wireless infrastructure, aerospace/defense adjacency, and high-performance analog content. (Skyworks Solutions, Inc.)
Broadcom — AVGO — Broadcom owns US manufacturing facilities in Fort Collins, Colorado, and Breinigsville, Pennsylvania. Fort Collins is strategically associated with FBAR filter production, while Breinigsville is tied to InP-based wafers for fiber optics. Broadcom’s US semiconductor manufacturing is not a broad foundry business, but it is highly relevant for vertically integrated RF filters and optical components, both of which are critical for wireless and datacenter infrastructure. (Broadcom Inc.)
Nokia / Infinera — NOK / NOKIA.HE — Nokia acquired Infinera in 2025, making Infinera’s US photonic integrated circuit assets part of Nokia. The relevant US facilities include San Jose, California, where InP PIC fabrication/foundry capability includes a cleanroom footprint, and Bethlehem, Pennsylvania, where advanced test and packaging for InP PICs includes 2.5D, 3D, and co-packaged optics-related work. The asset set is strategically important to optical transport, datacenter interconnect, coherent optics, and co-packaged optics roadmaps. (Semiconductor Industry Association)
Lumentum Holdings — LITE — Lumentum has announced a Greensboro, North Carolina, facility for advanced InP-based optical devices serving AI datacenter demand. The project includes a 6-inch InP line and is expected to ramp later in the decade, with volume ramp discussed for 2028. Lumentum’s US manufacturing relevance is tied to high-speed optical transceivers, datacenter photonics, and laser components rather than traditional silicon logic. (Lumentum Investor Relations)
Applied Optoelectronics — AAOI — Applied Optoelectronics has expanded its Houston-area manufacturing footprint, including facilities around Sugar Land, Texas, for optical components, lasers, semiconductor products, and transceivers. The company is vertically integrated in optical communications components, but public disclosures do not describe the US footprint as a merchant wafer foundry. The company should therefore be classified as a US optical-semiconductor manufacturing and assembly operator rather than a conventional silicon fab or OSAT. (Applied Optoelectronics, Inc.)
Rocket Lab USA / SolAero — RKLB — Rocket Lab’s SolAero business operates in Albuquerque, New Mexico, with production of space-grade solar cells and radiation-resistant compound semiconductor products. The CHIPS-supported expansion is intended to increase production capacity for satellite and space applications. This is a specialty compound-semiconductor manufacturing asset serving aerospace and defense end markets, not a general-purpose wafer foundry. (Semiconductor Industry Association)
Akash Systems — Private/no direct ticker — Akash Systems is developing a West Oakland, California, fab for diamond-cooled semiconductor substrates, devices, and systems. Public CHIPS-related disclosures describe a new cleanroom and manufacturing footprint focused on Diamond Cooling technology. The facility is relevant to thermal management constraints in high-power RF, satellite, and AI infrastructure, but it remains an emerging private-company manufacturing asset rather than an established high-volume foundry. (Semiconductor Industry Association)
SemiQ — Private/no direct ticker — SemiQ operates in Lake Forest, California, with cleanroom, wafer probe, wafer saw, epitaxy, wafer metrology, and SiC product capabilities. The company manufactures SiC diodes and MOSFETs and maintains custom epi-related capabilities. SemiQ is a private US SiC device and manufacturing participant, with strategic relevance to power electronics, although it is much smaller than Wolfspeed, Bosch, Coherent, or onsemi. (https://t.co/u391RxgxmV)
Navitas Semiconductor — NVTS — Navitas has announced an initial investment in a 3-reactor SiC epitaxy growth facility at its Torrance, California, headquarters and acquired GeneSiC as part of its expansion into SiC. Navitas remains primarily fabless for GaN and SiC device production, using external manufacturing partners such as TSMC and X-FAB, so its US footprint should be characterized as SiC epitaxy/R&D and related manufacturing capability rather than a full disclosed domestic wafer fab. (Navitas Semiconductor)
