Who mentions $INTL most on Surfaced?

@almacap114204 (AlmaCap) mentions $INTL most — 5 mentions in the past 12 months.

When was $INTL first mentioned on Surfaced?

The earliest tracked mention of $INTL in the Surfaced archive was on Apr 13, 2026.

How many voices track $INTL?

1 FinTwit voice has mentioned $INTL 5 times in the past 12 months.

What kind of voices mention $INTL most?

$INTL is mentioned most by Semis voices on Surfaced.

$INTL — FinTwit mentions on Surfaced

Recent mentions

5 mentions

@almacap114204May 2, 2026 · 7:00 AM

I called the memory narrative a week before fintwit caught on (and I have receipts). Similar process that worked for photonics.... Were you listening Anon? > GPU:CPU ratios in agentic workloads are collapsing from ~8 : 1 toward 1.5 : 1 — CPUs going from afterthought to bottleneck. > Two days deep on CPUs and the second-order trade became obvious: every agentic CPU pulls a DDR5 chip with it, and context windows keep growing. https://t.co/fDctM5nb61 >Key insight: CPU supply scales easily (hyperscaler ASICs etc.). Memory doesn't. > Pivoted hard into memory research: https://t.co/c6mB2rH2LV https://t.co/hG03JIx8DD >Found the highest-conviction name - I like Korea. https://t.co/oAJ82QsDrW > Earnings calls provide confirmation signal (FinTwit caught on at this point): https://t.co/y3jkTSJ7W5 > Now the question is how far, how fast - will be sharing my research on this. > You just have to ask the right questions early to beat the market Memory names I like: $MU, $SNDK, $402340, $000660, $DRAM CPU names I like: $ARM, $INTL Countries I like: Korea

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@almacap114204Apr 27, 2026 · 4:54 PM

Institutional risk capital is rotating out of defence/space (growth sectors) and into the AI semiconductor supply chain... We have know the plays for months, institutions are following The AI semis stack has visible capex, fat order books, long-term contracts (see MU signing 3–5 year orders) ...and a much longer runway of optimism ahead. "AI industrial revolution" and "agentics" sounds cool and its only early days... Extraordinary returns for: GPUs, CPUs, photonics, interconnects, and advanced packaging. To name a few: $NVDA, $INTL, $AAOI, $SIVE, $SOI, $MU, $SNDK, $RMBS, $LPK, $IQE, $ALMU Does this continue or is it a good time to move back to the laggards? > Space: $FLY, $ASTS, $RKLB, $MDA, $BKSY > Defence: $AEVX, $ONDS, $PLTR, $KTOS The majority of my portfolio sits in the AI semiconductor supply stack, and outperformance is driving that concentration further.

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@almacap114204Apr 17, 2026 · 12:18 PM

$LPK, >80% of TGV/metallisation players have already qualified and purchased equipment. Where could valuation go? Some speculation, as glass substrates are an entirely new and emerging market: > Advanced IC substrate market: $14bn organic today, total market → $31bn by 2030 (Yole) > AI/HPC/data centre: estimated quarter to a third of that and the fastest-growing segment. Could be a c.$10bn market by 2030, could be significantly higher given the scale and pace of the AI buildout > If glass becomes standard for AI packaging, which $INTL, Samsung, $TSMC and the entire Korean ecosystem are betting on, then a large share of AI substrate production could flow through LPKF's technology > Every glass core substrate needs TGVs drilled through it. LPKF's LIDE is the leading production-proven method at panel scale (>80% share, with Philoptics as the main competitor) > The equipment layer typically captures 10-15% of end-market value during buildout phases. LPKF's addressable share (TGV formation + singulation + bonding) is perhaps c.30% of that equipment layer. > At a $10bn AI substrate market, that gives LPKF c.$300-450m in annual revenue > Apply $ASML's 10-year median P/S of c.10x and you get c.€3-4bn. Current market cap: ~€250m. That's a 12-16x. I hold a long position in $LPK

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@almacap114204Apr 14, 2026 · 8:09 AM

$LPK / $LPKFF, why is glass better? Glass is superior to silicon due to better thermal properties and less warpage. That’s why it’s on $INTL's roadmap. But you knew that already anon. What makes LPKF glass the best in class is their through glass via (TGV). This just means tiny holes through the sheet of glass that the chiplets are bonded to. Other companies drill holes, introducing microfractures. Others use lasers, burning away the glass and creating debris. LKPF uses a tiny laser to treat the internal structure of the glass, not burning it, then applies a chemical to dissolve away the areas the laser has been to. This creates perfectly smooth holes which which you can coat in copper and create the shortest possible connection between chips”

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@almacap114204Apr 13, 2026 · 6:21 PM

$LPKF up c.30% today, I think I know why. $ALMU just announced a foundry partnership with $TSEM. While ALMU itself is III-V on silicon (not glass), it signals the broader AI chip packaging ecosystem is accelerating, and LPKF is a direct picks-and-shovels play on that. LPKF makes the LIDE laser drilling equipment that punches through-glass vias — the holes that make glass substrates electrically functional. No LPKF, no glass substrate. Confirmed customers building on LIDE: Samsung Electro-Mechanics, $INTL, LG Innotek, Toppan. Potential future customers: $NVDA, $AMD, $AMZN I see this ramp as "when not if." Today's ALMU/TSEM news confirms the ecosystem is real and building. c.€220M ($300m) market cap and lower risk than $ALMU in my mind. I hold a position. DYOR.

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