Who is Jukan @COMPUTEX?

Jukan @COMPUTEX (@jukan05) is a FinTwit voice tracked on Surfaced in the Semis category with 137.2k followers on X. Surfaced archives their cashtag mentions and plots each one on a price chart so the calls age publicly.

What stocks does @jukan05 mention most?

Over the past 12 months, @jukan05's most-mentioned tickers are $INTC, $MU, $NVDA, $DELL, $DRAM — $INTC leads with 7 mentions.

When did @jukan05 first mention $INTC?

@jukan05's first tracked mention of $INTC was on May 25, 2026.

How active is @jukan05?

In the past 12 months, @jukan05 posted 24 times carrying cashtag mentions, totalling 29 mentions across 13 distinct tickers.

Jukan @COMPUTEX (@jukan05) on Surfaced

Recent mentions

7 posts

@jukan05Jun 3, 2026 · 10:44 AM

Funda AI: "Marvell will design a networking chip for Google. This chip will be manufactured on Intel's 18A (or 18AP), with mass production scheduled to begin by the end of 2027, and it will be paired with the MediaTek-designed Humufish for Google." $INTC

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@jukan05Jun 2, 2026 · 7:06 AM

MediaTek at Goldman Sachs Taiwan Day: “The next-generation program is adopting only EMIB-T, with tape-out targeted for 4Q26 and mass production by 4Q27.” This is significantly different from what Taiwanese media had reported — that the next-generation program would use both CoWoS and EMIB-T in parallel. $INTC

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@jukan05May 30, 2026 · 11:43 PM

Morgan Stanley estimates Intel 18A yield at 50%. It also notes that Apple is currently the only customer that has “signed a contract.” $INTC https://t.co/i9hBtiaqyP

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@jukan05May 28, 2026 · 1:50 PM

Bruh, according to Geekerwan’s TEM analysis, Samsung’s 2026 SF2 still lags slightly behind Intel’s 2025 18A in terms of geometry control and process consistency. $INTC https://t.co/fsL07lJHhJ

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@jukan05May 28, 2026 · 7:12 AM

Intel Accelerates Foundry Revival, Spearheaded by Advanced Packaging Intel is accelerating the revival of its foundry (contract manufacturing) business through large-scale investment in advanced semiconductor packaging. By expanding infrastructure such as materials, components, and equipment, Intel is significantly scaling up its advanced packaging capacity to strengthen its response to the foundry customers it has recently secured. According to industry sources on the 28th, Intel is currently placing large-scale purchase orders for materials, components, and equipment from its global supply chain partners. Multiple supply contracts for materials, components, and equipment have reportedly already been signed. Some Korean materials/components/equipment companies are also participating. An industry official familiar with the matter said, "Advanced packaging facility investment on the scale of several trillion won is underway," adding, "Considering equipment lead times and the timing of materials and component supply, full-scale operation is expected next year." Intel is also discussing cooperation with some partners regarding facility investment in 2028. The investment locations cited as major packaging production hubs include the United States as well as Vietnam and Malaysia. This investment is said to be focused on expanding capacity for "EMIB (Embedded Multi-die Interconnect Bridge)." EMIB is Intel's proprietary 2.5D packaging technology that connects different semiconductors (dies). Signals are exchanged between chips via a silicon bridge embedded in the semiconductor substrate, and it is known to offer superior cost and productivity compared to the silicon interposer-based 2.5D packaging led by TSMC. In particular, it enables precise 2.5D packaging by connecting only the necessary areas with bridges. Intel is advancing EMIB further with technologies such as EMIB-T, which applies through-silicon via (TSV) technology to the bridge, and packaging that integrates glass substrates. The aim is to broaden its customer base by diversifying its packaging technologies. This materials/components/equipment investment also includes numerous new technologies to be applied to next-generation packaging. This packaging investment is a strategic move to strengthen foundry capabilities. Intel declared its re-entry into the foundry business in 2021 and pursued the development of advanced (front-end) processes, but it has struggled to secure major customers. This was largely due to TSMC's dominance in advanced chip foundry, including AI semiconductors. The packaging investment is also interpreted as a strategy to strengthen Intel's differentiated capabilities to attract foundry customers. Because the limits of circuit miniaturization mean the entire industry faces constraints in boosting chip performance through front-end processes, Intel is seen as attempting to break through this bottleneck with advanced packaging (back-end) and place its entire foundry business on a stable trajectory. Intel is also pursuing front-end advancement in parallel to maximize synergy. Last year, Intel brought its "Intel 18A" process—equivalent to the 2-nanometer (㎚) class—into full-scale operation. It has continued facility investment not only for its own chips but also to serve foundry customers. Another industry official predicted, "This packaging investment is evidence that Intel has secured a certain degree of advanced foundry process customers," and "The 18A process combined with expanded advanced packaging investment could be the starting signal for Intel's foundry revival." $INTC

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@jukan05May 26, 2026 · 11:37 PM

Exclusive: TSMC’s 3nm prices said to rise 15% in the second half; another 10% hike possible next year. C.C. Wei expected to “make things clear” at the shareholders’ meeting. $TSM $INTC https://t.co/mwxg6MOcYP

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@jukan05May 25, 2026 · 11:26 PM

Intel’s Lip-Bu Tan is reportedly set to arrive in Taiwan this week for a visit to TSMC. $INTC $TSM https://t.co/cZxABLQP9g

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Jukan @COMPUTEX

Jukan @COMPUTEX

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